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Openai/69109937-2170-8005-9304-da49840bb5b9
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===== 1. Cost and scalability: Dramatic reduction in assembly time and equipment cost. Passive alignment can be performed with standard semiconductor tools rather than custom optical benches. ===== # Yield and repeatability: Once the tolerances are locked in via lithography, every device aligns the same way. # Design flexibility: Integration of multiple optical elements (lasers, modulators, detectors) on a single interposer without complex micro-positioning. # Thermal stability: The interposer’s materials (e.g., silicon dioxide, polymers) maintain alignment through normal temperature cycling.
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